Influence of grain boundary structure: On bubble formation behaviour in helium implanted copper

被引：16
作者：
Thorsen, PA
BildeSorensen, JB
Singh, BN
机构：
来源：
INTERGRANULAR AND INTERPHASE BOUNDARIES IN MATERIALS, PT 2 | 1996年 / 207-卷
关键词：
grain boundary character; helium implantation; copper; bubble size and density; sink efficiency; grain boundary diffusion;
D O I：
10.4028/www.scientific.net/MSF.207-209.445
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Grain boundaries in copper implanted with helium at elevated temperature have been examined by transmission electron microscopy. Helium bubbles are formed at the boundaries while denuded zones are formed along some of the boundaries. The character of a number of boundaries were determined and related to the size of the bubbles in the boundary and to the width of the denuded zones. The results are discussed in terms of the efficiency of the boundaries as sinks and diffusion paths for helium.
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收藏
页码：445 / 448
页数：4
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