Modelling wide gap TLP bonding of Ti-48 at.-%Al-2 at.-%Cr-2 at.-%Nb alloys

被引：8
作者：
Zhou, T [1 ]
Gale, WF [1 ]
机构：
[1] Auburn Univ, Mat Res & Educ Ctr, Auburn, AL 36849 USA
来源：
MATERIALS SCIENCE AND TECHNOLOGY | 2003年 / 19卷 / 08期
关键词：
D O I：
10.1179/026708303225004594
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Modelling of the wide gap transient liquid phase (TLP). bonding of a Ti-48 at.-%Al-2 at.-%Cr-2 at.-%-Nb (48-2-2) alloy with 48-2-2+Cu composite interlayers is examined. The role of the 48-2-2 powder particles in the composite interlayers during the isothermal solidification process was studied. This work was based on a high apparent diffusion coefficient of Cu in the multiphase gamma TiAl/alpha(2) Ti3Al 48-2-2 alloy, combined with a low Cu solubility in 48-2-2. The redistribution, during bonding and post-bond heat treatment, of the Cu placed into the original composite interlayer is discussed. The model is used to account for the observed behaviour of 48-2-2+Cu composite interlayer bonds.
引用
收藏
页码：1084 / 1090
页数：7
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