CAD models for multilayered substrate interdigital capacitors

被引:339
作者
Gevorgian, SS
Martinsson, T
Linner, PLJ
Kollberg, EL
机构
[1] Department of Microwave Technology, Chalmers University of Technology, Gothenhurg
关键词
D O I
10.1109/22.506449
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Conformal mapping-based models are given far interdigital capacitors on substrates with a thin superstrate and/or covering dielectric film, The models are useful for a wide range of dielectric constants and layer thicknesses, Capacitors with finger numbers n greater than or equal to 2 are discussed, The linger widths and spacing between them may be different, The results are compared with the available data and some examples are given to demonstrate the potential of the models.
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页码:896 / 904
页数:9
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