Assessment of diffusional mobilities in bcc Cu-Sn and bcc Cu-Zn alloys

被引:0
作者
Alvares, Ebert D. M. [1 ]
Preussner, Johannes [1 ]
机构
[1] Fraunhofer IWM, Wohlerstr 11, D-79108 Freiburg, Germany
关键词
copper alloys; diffusion; modeling; MODEL; COPPER;
D O I
10.3934/matersci.2019.6.1153
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The Cu-Sn-Zn alloy system is technically very important. Brass (Cu-Zn) and bronze (Cu-Sn) alloys have been used and developed for tools and components for over thousands of years and are still used in a wide range of applications like marine components, bearings, music instruments and for components in contact with corrosive media. Even though it is a very old and well-studied alloy system, there are only few studies that analyze Cu-Sn-Zn coating systems. Furthermore very basic properties like the diffusion through different phases are not studied in detail. In this work experimental diffusion data in the literature is critically reviewed. On the basis of these studies a diffusion mobility database for the bcc phase of the ternary Cu-Sn-Zn is presented. The database was established using the DICTRA-type (DIffusion Controlled TRAnsformation) diffusion modeling. The resulting curves for the interdiffusion coefficient for various alloy concentrations are then compared to available literature data. Furthermore, experiments from diffusion couples are recalculated for validation. A good fit of these experimental data could be realized using only few parameters.
引用
收藏
页码:1153 / 1163
页数:11
相关论文
共 50 条
[41]   Measurements of mechanical properties of α-phase in Cu-Sn alloys by using instrumented nanoindentation [J].
Li, Yang ;
He, Kang ;
Liao, Chengwei ;
Pan, Chunxu .
JOURNAL OF MATERIALS RESEARCH, 2012, 27 (01) :192-196
[42]   Intermetallic Cu3Sn as Oxidation Barrier for Fluxless Cu-Sn Bonding [J].
Liu, H. ;
Wang, K. ;
Aasmundtveit, K. ;
Hoivik, N. .
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, :853-857
[43]   Study of diffusion mobilities of Nb and Zr in bcc Nb-Zr alloys [J].
Liu, Yajun ;
Zhang, Lijun ;
Pan, Tongyan ;
Yu, Di ;
Ge, Yang .
CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 2008, 32 (03) :455-461
[44]   Diffusivities and Atomic Mobilities for the Cu-Rich fcc Cu-Al-Sn Alloys at 1073 K [J].
Premovic, Milena ;
Dui, Yong ;
Liu, Yuling ;
Dui, Changfa ;
Weng, Shiyi ;
Deng, Peng ;
Min, Qianhui ;
Liu, Xinhui .
JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2020, 41 (04) :378-389
[45]   Revisiting the Phase Equilibria in the Cu-Zn Binary System [J].
Lee, Hyoungrok ;
Lee, Inho ;
Xu, Xiao ;
Omori, Toshihiro ;
Kainuma, Ryosuke .
JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2024, 45 (03) :304-317
[46]   Enhanced voiding in Cu-Sn micro joints [J].
Njuki, M. ;
Thekkut, S. ;
Sivasubramony, R. ;
Greene, C. M. ;
Shahane, N. ;
Thompson, P. ;
Mirpuri, K. ;
Borgesen, P. ;
Dimitrov, N. .
MATERIALS RESEARCH BULLETIN, 2022, 150
[47]   Effects of Cu, Zn and Cu-Zn addition on the microstructure and antibacterial and photocatalytic functional properties of Cu-Zn modified TiO2 nano-heterostructures [J].
Tobaldi, D. M. ;
Piccirillo, C. ;
Rozman, N. ;
Pullar, R. C. ;
Seabra, M. P. ;
Skapin, A. Sever ;
Castro, P. M. L. ;
Labrincha, J. A. .
JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY A-CHEMISTRY, 2016, 330 :44-54
[48]   Effect of addition of Ni and Si on the microstructure and mechanical properties of Cu-Zn alloys [J].
Chen, Wei ;
Jia, Yanlin ;
Yi, Jiang ;
Wang, Mingpu ;
Derby, Benjamin ;
Lei, Qian .
JOURNAL OF MATERIALS RESEARCH, 2017, 32 (16) :3137-3145
[49]   Effect of Grain Size of Cu-Zn Alloys on Dislocation-Strengthening Factors [J].
Nakagawa, Koutarou ;
Hayashi, Momoki ;
Takano-Satoh, Kozue ;
Matsunaga, Hirotaka ;
Mori, Hiroyuki ;
Kitahara, Amane ;
Onuki, Yusuke ;
Suzuki, Shigeru ;
Sato, Shigeo .
JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS, 2020, 84 (12) :374-381
[50]   Cyclic softening behaviors of ultra-fine grained Cu-Zn alloys [J].
Zhang, Z. J. ;
Zhang, P. ;
Zhang, Z. F. .
ACTA MATERIALIA, 2016, 121 :331-342