Electromigration-induced formation of percolating adsorbate islands during condensation from the gaseous phase: a computational study

被引:2
作者
Dvornichenko, Alina, V [1 ]
Kharchenko, Vasyl O. [2 ]
Kharchenko, Dmitrii O. [2 ]
机构
[1] Sumy State Univ, 2 Rimskii Korsakov St, UA-40007 Sumy, Ukraine
[2] Natl Acad Sci Ukraine, Inst Appl Phys, 58 Petropavlivska St, UA-40000 Sumy, Ukraine
关键词
adsorptive systems; electromigration; numerical simulations; pattern formation; thin films; SURFACE-MORPHOLOGY; GE; ORGANIZATION; NUCLEATION; DEPOSITION; EVOLUTION; CLUSTERS; SI(111);
D O I
10.3762/bjnano.12.55
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We provide a computational study of a change in the morphology of a growing thin film during condensation caused by electromigration effects. It will be shown, that separated circular adsorbate islands, realized in an isotropic system, become elongated in the direction of the applied electrical field. We discuss the dependence of the critical value of the strength of the applied electrical field, responsible for the formation of percolating adsorbate islands, on main control parameters. This study provides insight into details of electromigration effects during the self-organization of adatoms into percolating adsorbate islands during condensation from the gaseous phase. We will show that the elongated morphology of adsorbate islands remains stable if the electric field is turned off.
引用
收藏
页码:694 / 703
页数:10
相关论文
共 78 条
[1]  
[Anonymous], 2003, SPRINGER SERIES COMP, DOI DOI 10.1007/978-3-662-09017-6
[2]   Nonlinear Wavelength Selection in Surface Faceting under Electromigration [J].
Barakat, Fatima ;
Martens, Kirsten ;
Pierre-Louis, Olivier .
PHYSICAL REVIEW LETTERS, 2012, 109 (05)
[3]   Nucleation kinetics and global coupling in reaction-diffusion systems [J].
Battogtokh, D ;
Hildebrand, M ;
Krischer, K ;
Mikhailov, AS .
PHYSICS REPORTS-REVIEW SECTION OF PHYSICS LETTERS, 1997, 288 (1-6) :435-456
[4]   ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J].
BLACK, JR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) :338-&
[5]   Phase transitions and adsorption isotherm in multilayer adsorbates with lateral interactions [J].
Casal, SB ;
Wio, HS ;
Mangioni, S .
PHYSICA A-STATISTICAL MECHANICS AND ITS APPLICATIONS, 2002, 311 (3-4) :443-457
[6]   Birth and morphological evolution of step bunches under electromigration [J].
Chang, J ;
Pierre-Louis, O ;
Misbah, C .
PHYSICAL REVIEW LETTERS, 2006, 96 (19)
[7]   Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints [J].
Chen, Chih ;
Tong, H. M. ;
Tu, K. N. .
ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 40, 2010, 40 :531-555
[8]   Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps - art. no. 072102 [J].
Chiang, KN ;
Lee, CC ;
Lee, CC ;
Chen, KM .
APPLIED PHYSICS LETTERS, 2006, 88 (07)
[9]   Formation of nanoislands by the electromolding self-organization process [J].
Chiu, C. -H. ;
Huang, Z. ;
Poh, C. T. .
PHYSICAL REVIEW B, 2006, 73 (19)
[10]   Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization [J].
Choi, WJ ;
Yeh, ECC ;
Tu, KN .
JOURNAL OF APPLIED PHYSICS, 2003, 94 (09) :5665-5671