On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

被引：137
作者：
Yan, J [1 ]
Yoshino, M [1 ]
Kuriagawa, T [1 ]
Shirakashi, T [1 ]
Syoji, K [1 ]
Komanduri, R [1 ]
机构：
[1] Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2001年 / 297卷 / 1-2期
基金：
美国国家科学基金会;
关键词：
silicon; ductile machining; ultra-precision machining; hydrostatic pressure;
D O I：
10.1016/S0921-5093(00)01031-5
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40 degrees) and a high side cutting edge angle (SCEA) (similar to 88 degrees) and undeformed chip thickness in the nanometric range (similar to 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (similar to 400 MPa) apparatus. (C) 2001 Elsevier Science B.V. All rights reserved.
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页码：230 / 234
页数：5
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