Local bending moment as a measure of adhesion: The blister test

被引:1
作者
Goussev, OA [1 ]
Zeman, K [1 ]
Suter, UW [1 ]
机构
[1] ETH Zurich, Inst Polymere, CH-8092 Zurich, Switzerland
关键词
adhesion; adhesion energy; adhesive fracture test; blister test; elastic plate behavior; critical reaction moment; local bending moment;
D O I
10.1080/00218469608010498
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
We propose to characterize joints between materials by the maximum bending moment, M-max, borne just prior to delamination. We suggest to evaluate M-max in the blister test geometry through direct measurement of the blister curvature in the vicinity of the separation line and employ a scanning capacitance microscope for the blister profiling. The methodology and apparatus were tested on measurements of adhesion of two commercial polymer films to Plexiglas and Teflon.
引用
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页码:45 / 57
页数:13
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