Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

被引：0

作者：

Tsukamoto, Hideaki ^{[1
]}

Dong, Zigang ^{[1
]}

Huang, Han ^{[1
]}

Nishimura, Tetsuro ^{[2
]}

Nogita, Kazuhiro ^{[1
]}

机构：

[1] Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia

[2] Nihon Super Co Ltd, Osaka 5640063, Japan

来源：

PRICM 7, PTS 1-3 | 2010年 / 654-656卷

基金：

澳大利亚研究理事会;

关键词：

Intermetallics; lead-free solder; nanoindentation; indentation creep; strain rate sensitivity; activation volume; NITRIDE THIN-FILMS; MECHANICAL-PROPERTIES; RELIABILITY; EVOLUTION;

D O I：

10.4028/www.scientific.net/MSF.654-656.2446

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/ Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)(6)Sn-5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn5 and (Cu,Ni)(6)Sn-5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)(6)Sn-5 were estimated from 0.128 b(3) to 0.624 b(3) (b=4.2062x10(-9) m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.

引用

页码：2446 / +

页数：2

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