Convergence of SoC architecture and semiconductor manufacturing through AILVIL systems

被引：0

作者：

Bodapati, Srinivas ^{[1
]}

Ranade, Pushkar ^{[1
]}

Nagisetty, Ramune ^{[1
]}

机构：

[1] Intel Corp, Santa Clara, CA 95051 USA

来源：

2021 58TH ACM/IEEE DESIGN AUTOMATION CONFERENCE (DAC) | 2021年

关键词：

D O I：

10.1109/DAC18074.2021.9586243

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

AI/ML systems have been deployed in both SoC design/architecture as well as in semiconductor manufacturing over the years. These systems have been independent of each other with process design kits (PDK) being the interface between design and manufacturing. Recent advances in packaging technology and the adoption of chiplet architecture has opened exciting avenues for merged AI/ML systems that bring SoC architecture and manufacturing together. This work explores this opportunity of enabling an AI/ML system that brings manufacturing and design information together for chiplet architecture exploration

引用

页码：1307 / 1310

页数：4

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