Study of non-anhydride curing system for no-flow underfill applications

被引：0
|
作者：
Zhang, ZQ [1 ]
Fan, LH [1 ]
Wong, CP [1 ]
机构：
[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
来源：
51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE | 2001年
关键词：
D O I：
10.1109/ECTC.2001.928031
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using non-anhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties and the reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with non-anhydride underfill shows high reliability during the thermal shock test. Using proper fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.
引用
收藏
页码：1474 / 1478
页数：5
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