A new micromachined sensor system for tactile measurements of high aspect ratio microstructures

被引：2

作者：

Balke, M. ^{[1
]}

Peiner, E. ^{[1
]}

Doering, L. ^{[2
]}

机构：

[1] Tech Univ Carolo Wilhelmina Braunschweig, Inst Semicond Technol, D-38106 Braunschweig, Germany

[2] Phys Tech Bundesanstalt, D-38116 Braunschweig, Germany

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2008年 / 14卷 / 4-5期

关键词：

Etch Rate; Deep Hole; Wheatstone Bridge; Tetramethylammonium Hydroxide; Cantilever Deflection;

D O I：

10.1007/s00542-007-0452-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new tactile sensor with piezoresistive read-out is presented. The sensor is designed for measurements of high aspect ratio structures with a resolution of some 10 nm and a measuring range of hundreds of micrometer. Possible applications of the sensor are suggested. The silicon micromachining fabrication process is shown in detail next to the finite element simulations we performed. First measurements and a calibration process are described and the results are shown. The implementation into a measuring system is indicated.

引用

页码：543 / 549

页数：7

共 6 条

[1] DATSKOS PG, 2004, ENCY NANOSCIENCE NAN, V10, P1
[2] First-order piezoresistance coefficients in silicon crystals
Kozlovskiy, SI
Boiko, II
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2005, 118 (01) : 33 - 43
[3] Anisotropic etching of {100} and {110} planes in (100) silicon
Powell, O
Harrison, HB
[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2001, 11 (03) : 217 - 220
[4] TORTONESE M, 1993, APPL PHYS LETT, V62, P234
[5] The evolution from convex corner undercut towards microneedle formation: theory and experimental verification
Wilke, N
Reed, ML
Morrissey, A
[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2006, 16 (04) : 808 - 814
[6] WILKE N, 2004, FABRICATION CHARACTE

← 1 →