Fabrication of Test Structures to Monitor Stress in SU-8 Films used for MEMS Applications

被引：6

作者：

Smith, S. ^{[1
]}

Brockie, N. L. ^{[1
]}

Murray, J. ^{[1
]}

Wilson, C. J. ^{[2
,3
]}

Horsfall, A. B. ^{[2
]}

Terry, J. G. ^{[1
]}

Stevenson, J. T. M. ^{[1
]}

Mount, A. R. ^{[4
]}

Walton, A. J. ^{[1
]}

机构：

[1] Univ Edinburgh, Sch Engn, Scottish Microelect Ctr, Inst Integrated Micro & Nano Syst, Edinburgh EH9 3JF, Midlothian, Scotland

[2] Newcastle Univ, Sch Elect Elect & Comp Engn, Newcastle Upon Tyne NE1 7RU, Tyne & Wear, England

[3] IMEC, B-3001 Heverlee, Belgium

[4] Univ Edinburgh, Sch Chem, Edinburgh EH9 3JJ, Midlothian, Scotland

来源：

2010 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, 23RD IEEE ICMTS CONFERENCE PROCEEDINGS | 2010年

关键词：

D O I：

10.1109/ICMTS.2010.5466870

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

SU-8, an epoxy based negative photoresist, is widely used in the manufacture of micromechanical systems but can exhibit significant levels of stress build-up during processing. This paper describes micromechanical test structures that provide the opportunity to spatially characterise stress the in SU-8 at different stages of the process. The structures are fabricated in a thick layer of SU-8 and are subsequently released from the underlying substrate using a dry chemical vapour etch process. The initial results indicate that there is significant tensile stress in the SU-8, and that this demonstrates a radial variation along with a dependence on the process conditions.

引用

页码：8 / 13

页数：6

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