This paper reports effects of heat treatment in nitrogen or forming gas ambient on the electrical properties of highly resistive float zone p-type silicon (Si). Capacitance-voltage and Hall Effect measurements were used to examine role of impurities associated with annealing. A reduction in the free carrier density was observed for both the nitrogen and forming gas anneals. In addition, temperature-dependent capacitance measurements revealed the appearance of deep traps with a concentration of 2 x 10(11) cm(-3), following the nitrogen anneal. (C) 2007 Elsevier B.V. All rights reserved.