Impact of channel mobility on design optimization of 600-3300 V-class high-speed GaN vertical-trench MOSFETs based on TCAD simulation

被引:5
作者
Ishida, Takashi [1 ]
Sakao, Keisuke [1 ]
Kachi, Tetsu [2 ]
Suda, Jun [1 ,2 ]
机构
[1] Nagoya Univ, Dept Elect, Chikusa Ku, Furo Cho, Nagoya, Aichi 4648601, Japan
[2] Nagoya Univ, Inst Mat & Syst Sustainabil, Chikusa Ku, Furo Cho, Nagoya, Aichi 4648601, Japan
关键词
gallium nitride; switching performance; chip cost; power device; vertical MOSFET; GaN;
D O I
10.35848/1882-0786/ac18af
中图分类号
O59 [应用物理学];
学科分类号
摘要
To simultaneously evaluate the switching performance and cost (required chip size) of GaN vertical-trench metal-oxide-semiconductor field-effect transistors, we calculated R (on) AR (on) Q (g) considering the Miller effect with various cell pitches, channel mobilities, and blocking voltages. When the blocking voltage was 600 V, optimized cell pitches of 8 and 12 mu m minimized R (on) AR (on) Q (g) with channel mobilities of 100 and 200 cm(2) V-1 s(-1), respectively. Moreover, a wide range of cell pitches could maintain a low R (on) AR (on) Q (g) with a channel mobility of 200 cm(2) V-1 s(-1). This indicates that a channel mobility of 100 cm(2) V-1 s(-1) or higher, particularly 200 cm(2) V-1 s(-1), is desirable for a good switching performance and low cost.
引用
收藏
页数:5
相关论文
共 27 条
  • [1] [Anonymous], 2017, TECH DIG, DOI DOI 10.1109/IEDM.2017.8268359
  • [2] Chow TP, 2015, WIPDA 2015 3RD IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS, P402, DOI 10.1109/WiPDA.2015.7369328
  • [3] First Demonstration of AlSiO as Gate Dielectric in GaN FETs; Applied to a High Performance OG-FET
    Gupta, Chirag
    Chan, Silvia H.
    Agarwal, Anchal
    Hatui, Nirupam
    Keller, Stacia
    Mishra, Umesh K.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2017, 38 (11) : 1575 - 1578
  • [4] Improvement of channel property of GaN vertical trench MOSFET by compensating nitrogen vacancies with nitrogen plasma treatment
    Ishida, Takashi
    Nam, Kyung Pil
    Matys, Maciej
    Uesugi, Tsutomu
    Suda, Jun
    Kachi, Tetsu
    [J]. APPLIED PHYSICS EXPRESS, 2020, 13 (12)
  • [5] Improved Dynamic RON of GaN Vertical Trench MOSFETs (OG-FETs) Using TMAH Wet Etch
    Ji, Dong
    Li, Wenwen
    Agarwal, Anchal
    Chan, Silvia H.
    Haller, Jeffrey
    Bisi, Davide
    Labrecque, Michelle
    Gupta, Chirag
    Cruse, Bill
    Lal, Rakesh
    Keller, Stacia
    Mishra, Umesh K.
    Chowdhury, Srabanti
    [J]. IEEE ELECTRON DEVICE LETTERS, 2018, 39 (07) : 1030 - 1033
  • [6] 880 V/2.7 mΩ . cm2 MIS Gate Trench CAVET on Bulk GaN Substrates
    Ji, Dong
    Agarwal, Anchal
    Li, Haoran
    Li, Wenwen
    Keller, Stacia
    Chowdhury, Srabanti
    [J]. IEEE ELECTRON DEVICE LETTERS, 2018, 39 (06) : 863 - 865
  • [7] Recent progress of GaN power devices for automotive applications
    Kachi, Tetsu
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2014, 53 (10)
  • [8] A vertical insulated gate AlGaN/GaN heterojunction field-effect transistor
    Kanechika, Masakazu
    Sugimoto, Masahiro
    Soejima, Narumasa
    Ueda, Hiroyuki
    Ishiguro, Osamu
    Kodama, Masahito
    Hnyashi, Eiko
    Itoh, Kenji
    Uesugi, Tsutomu
    Kachi, Tetsu
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2007, 46 (20-24): : L503 - L505
  • [9] Highly reliable AlSiO gate oxides formed through post-deposition annealing for GaN-based MOS devices
    Kikuta, Daigo
    Ito, Kenji
    Narita, Tetsuo
    Kachi, Tetsu
    [J]. APPLIED PHYSICS EXPRESS, 2020, 13 (02)
  • [10] Al2O3/SiO2 nanolaminate for a gate oxide in a GaN-based MOS device
    Kikuta, Daigo
    Itoh, Kenji
    Narita, Tetsuo
    Mori, Tomohiko
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2017, 35 (01):