Hybrid Modeling Method for Multilayered Power/Ground Planes by Delaunay Triangulation

被引：0
|
作者：
Watanabe, Takayuki [1 ]
机构：
[1] Univ Shizuoka, Res Ctr ICT Innovat, Shizuoka, Japan
来源：
2014 IEEE 23RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS | 2014年
关键词：
SIMULATION; LIM;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a hybrid modeling method based on the triangular mesh for the transient simulation of multilayered power/ground planes is proposed. The equivalent circuits obtained by the proposed modeling method can be solved efficiently by not only the SPICE but also the LIM-like leapfrog scheme. Additionally, the use of the Graphical Processing Unit (GPU) enables to accelerate the transient simulation of our models.
引用
收藏
页码：155 / 158
页数：4
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