Realtime 3D stress measurement in curing epoxy packaging

被引：0
|
作者：
Richter, J. [1 ]
Hyldgard, A. [1 ]
Birkelund, K. [1 ]
Hansen, O. [1 ]
Thomsen, E. V. [1 ]
机构：
[1] Tech Univ Denmark, Dept Micro & Nanotechnol, DK-2800 Lyngby, Denmark
来源：
TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 2007年
关键词：
stress sensor; epoxy; packaging;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a novel method to characterize stress in microsystern packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigma(xx)-sigma(yy)=6.7 MPa and (sigma(xx)+sigma(yy)-0.4 sigma(zz))=232 MPa.
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页数：2
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