Conductive SU8 photoresist for microfabrication

被引：73
作者：
Jiguet, S [1 ]
Bertsch, A
Hofmann, H
Renaud, P
机构：
[1] Ecole Polytech Fed Lausanne, STI, IMM, LMIS4, CH-1015 Lausanne, Switzerland
[2] Ecole Polytech Fed Lausanne, STI, IMX, LTP, CH-1015 Lausanne, Switzerland
来源：
ADVANCED FUNCTIONAL MATERIALS | 2005年 / 15卷 / 09期
关键词：
D O I：
10.1002/adfm.200400575
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
A conductive composite photoresist has been developed for the direct photpatterning of electrodes. It is based on a dispersion of silver nanoparticles in SU8, a non-conductive, negative-tone photoresist. Manufactured structures have an electrical conductivity at a low silver content of around 6 vol.-%.
引用
收藏
页码：1511 / 1516
页数：6
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