Study of reflection power and surface roughness of Cu nanolayers thin film with respect to various deposition rates of sputtering

Copper thin films have been deposited on glass substrate, by dc magnetron sputtering, then Reflection power and surface roughness of them with respect to deposition parameters have been investigated. For these purposes discharge current was changed in (0.2-1) A and gas pressure (Ar) range of (0.02-0.1) mbar was used. Due to these variations voltage differs from 320 to 395 V and deposition rate of (0.4-2.5) nm/sec were obtained. In different coating condition while thickness of produced thin films was constant (250 nm), reflection power and roughness of them were investigated by a double beam spectrophotometer and AFM respectively. These parameters for some thin films which were produced in the same conditions but have different thicknesses have been investigated too.