An anti-leakage liquid metal thermal interface material

被引：47

作者：

Huang, Kaiyuan ^{[1
]}

Qiu, Wangkang ^{[1
]}

Ou, Meilian ^{[1
]}

Liu, Xiaorui ^{[2
]}

Liao, Zenan ^{[3
]}

Chu, Sheng ^{[1
]}

机构：

[1] Sun Yat Sen Univ, State Key Lab Optoelect Mat & Technol, Guangzhou, Peoples R China

[2] Huwei Technol Co Ltd, Shenzhen 518129, Peoples R China

[3] Guangtai Technol Co Ltd, Dongguan 523590, Peoples R China

来源：

RSC ADVANCES | 2020年 / 10卷 / 32期

基金：

中国国家自然科学基金;

关键词：

MELTING TEMPERATURE ALLOYS; PERFORMANCE; CONDUCTIVITY; DESIGN;

D O I：

10.1039/d0ra02351e

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Liquid metals (LMs) offer extremely low thermal resistance, and have been studied as an emerging thermal interface material (TIM). In this work, we propose an improved form of LM/indium film/LM sandwich pad as an efficient TIM. The sandwich-like structure was designed to avoid liquid leakage and oxidation of LM, and additional micropillar arrays were fabricated on the surface, which benefitted the improved wetting of the substrate surface. A series of thermal tests revealed the anti-leakage characteristic and thermal stability of LM/indium film/LM, whose thermal resistance can also reach as low as 0.036 cm(2) K W-1. Additionally, the heat dissipation test performed on a commercial smart phone demonstrated that a LM/In/LM pad not only reduced the temperature of the CPU and back cover but also enhanced the runtime of a battery by 25%

引用

页码：18824 / 18829

页数：6

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