Barium Strontium Titanate Capacitor Fabrication on Copper Printed Circuit Board

被引：3

作者：

Freundorfer, Al P. ^{[1
]}

Sayer, Michael ^{[2
]}

Po, Justin ^{[1
]}

机构：

[1] Queens Univ, Dept Comp & Elect Engn, Kingston, ON K7L 3N6, Canada

[2] Queens Univ, Dept Phys, Kingston, ON K7L 3N6, Canada

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 11期

关键词：

Barium compounds; capacitors; dielectric devices; electronic components; varactors; COMPOSITE THIN-FILMS; SOL-GEL; TEMPERATURE; INTEGRATION;

D O I：

10.1109/TCPMT.2016.2609400

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Procedures are described to fabricate barium strontium titanate (BST) gap capacitors within a microstrip resonator fabricated directly on a printed circuit board (PCB). This is the first time that an all-BST ceramic has been processed on epoxy-based PCBs at 175 degrees C. In order to accommodate the temperature limitations of the underlying PCB (< 200 degrees C), and to achieve the required dimensions, similar to 75-mu m (3 mil) gap capacitors have been fabricated by hydrothermal processing of BST sol-gel composites. The performance of voltage-tunable microstrip resonators operating from 5 to 10 GHz showed a permittivity of 52 at 7.05 GHz and a voltage tunability consistent with that expected for thin-film BST devices. Measurements of these resonators are presented.

引用

页码：1663 / 1666

页数：4

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