Mechanism of enlargement of intimately contacted area in anodic bonding of Kovar alloy to borosilicate glass

被引：22

作者：

Morsy, MA ^{[1
]}

Ikeuchi, K ^{[1
]}

Ushio, M ^{[1
]}

Abe, H ^{[1
]}

机构：

[1] AYUMI IND CO LTD,HIMEJI,HYOGO 67102,JAPAN

来源：

MATERIALS TRANSACTIONS JIM | 1996年 / 37卷 / 09期

关键词：

anodic bonding; Kovar alloy; borosilicate glass; intimate contact enlargement; rate controlling step; charge transfer; bonding mechanism;

D O I：

10.2320/matertrans1989.37.1511

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of the bonding temperature and voltage on the rate of the enlargement of intimately contacted area in the anodic bonding of the Kovar alloy to borosilicate glass have been studied systematically in order to obtain better understanding of the rate controlling factor of the process. It was suggested that the attainment of intimate contact was controlled by two factors having different activation energies depending on the bonding temperature. At bonding temperatures higher than 669-687 K (depending on the bonding voltage), the estimated activation energy was close to that of the viscous flow of the glass. At lower bonding temperatures, the estimated activation energy was close to that of the conductivity of the glass. A mechanism of the enlargement of intimately contacted area during the anodic bonding is proposed to explain these results.

引用

页码：1511 / 1517

页数：7

共 15 条

[1] IRREVERSIBILITY OF ANODIC BONDING [J].