Synthesis of poly(silmethylene)s via ring-opening polymerization of benzocyclobutene functionalized disilacyclobutene and their low-dielectric and thermal properties

In this work, benzocyclobutene-introduced poly(silmethylene)s were synthesized by ring-opening copolymerization of benzocyclobutene (BCB) functionalized disilacyclobutene with phenyldisilacyclobutene. The incorporation ratio of BCB was tailored by changing feeding ratio of 1,3-dimethyl-1,3-dibenzocyclobutene-1,3-disilacyclobutane and 1,3-dimethyl-1,3-diphenyl-1,3-disilacyclobutane, thus enabling the control of ultimate properties of cured resins. With increasing the incorporation ratios of BCB from 9.5 to 28.9mol%, T5% of cured resins is improved from 404 degrees C to 462 degrees C, while the dielectric constant is decreased from 2.59 to 2.41 at 10MHz. The excellent thermal stability and low-dielectric performance make such thermosets potential inter-layered or inter-lined low-dielectric media. Copyright (c) 2017 John Wiley & Sons, Ltd.