A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology

被引：40

作者：

Amend, P. ^{[1
]}

Pscherer, C. ^{[1
]}

Rechtenwald, T. ^{[1
]}

Frick, T. ^{[1
]}

Schmidt, M. ^{[1
]}

机构：

[1] Bayer Laserzentrum GmbH, Erlangen, Germany

来源：

LASER ASSISTED NET SHAPE ENGINEERING 6, PROCEEDINGS OF THE LANE 2010, PART 2 | 2010年 / 5卷

关键词：

molded interconnect device (MID); rapid prototyping (RP); selective laser sintering (SLS); laser structuring and metallization;

D O I：

10.1016/j.phpro.2010.08.084

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This paper presents experimental results of manufacturing MID-prototypes by means of SLS, laser structuring and metallization. Therefore common SLS powder (PA12) doped with laser structuring additives is used. First of all the influence of the additives on the characteristic temperatures of melting and crystallization is analyzed by means of DSC. Afterwards the sintering process is carried out and optimized by experiments. Finally the generated components are qualified regarding their density, mechanical properties and surface roughness. Especially the surface quality is important for the metallization process. Therefore surface finishing techniques are investigated. (C) 2010 Published by Elsevier B.V.

引用

页码：561 / 572

页数：12

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