Effects of RTA Rising Time on Ferroelectric Characteristics of HfZrO2

被引:7
作者
Han, Changhyeon [1 ,2 ]
Kwon, Seok Jin [1 ,2 ]
Yim, Jiyong [1 ,2 ]
Kim, Jeonghan [1 ,2 ]
Kim, Sangwoo [1 ,2 ]
Jeong, Soi [1 ,2 ]
Park, Eun Chan [1 ,2 ]
You, Ji Won [1 ,2 ]
Choi, Rino [3 ]
Kwon, Daewoong [1 ,2 ]
机构
[1] Inha Univ, Dept Elect & Comp Engn, Incheon 22212, South Korea
[2] Inha Univ, 3D Convergence Ctr, Incheon 22212, South Korea
[3] Inha Univ, Dept Mat Sci & Engn, Incheon 22212, South Korea
基金
新加坡国家研究基金会;
关键词
Ferroelectricity annealing method; grain size engineering; HfZrO2 ferroelectric (FE) material;
D O I
10.1109/TED.2022.3168237
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ferroelectric (FE) properties of HfZrO2 were studied by modulating the rapid thermal annealing (RTA) rising time (T-r). As T-r becomes shorter, the polarization is clearly observed to increase prior to becoming saturated. On the contrary, the leakage current that is flowing through the FE film increases continuously. Our analysis of the FE properties of the material indicated that smaller grains are formed in the FE films after RTA with a shorter T-r, and that the T-r-induced grain size determines the polarization switching and leakage current. Accordingly, our findings confirmed that both the polarization and leakage current can be simultaneously co-optimized using grain size engineering by modulating T-r.
引用
收藏
页码:3499 / 3502
页数:4
相关论文
共 23 条
  • [1] Phase transitions in ferroelectric silicon doped hafnium oxide
    Boescke, T. S.
    Teichert, St.
    Braeuhaus, D.
    Mueller, J.
    Schroeder, U.
    Boettger, U.
    Mikolajick, T.
    [J]. APPLIED PHYSICS LETTERS, 2011, 99 (11)
  • [2] Ferroelectricity in hafnium oxide thin films
    Boescke, T. S.
    Mueller, J.
    Braeuhaus, D.
    Schroeder, U.
    Boettger, U.
    [J]. APPLIED PHYSICS LETTERS, 2011, 99 (10)
  • [3] Effects of Capping Electrode on Ferroelectric Properties of Hf0.5Zr0.5O2 Thin Films
    Cao, Rongrong
    Wang, Yan
    Zhao, Shengjie
    Yang, Yang
    Zhao, Xiaolong
    Wang, Wei
    Zhang, Xumeng
    Lv, Hangbing
    Liu, Qi
    Liu, Ming
    [J]. IEEE ELECTRON DEVICE LETTERS, 2018, 39 (08) : 1207 - 1210
  • [4] Chicea D, 2014, ROM REP PHYS, V66, P778
  • [5] Ultra-thin Hf0.5Zr0.5O2 thin-film-based ferroelectric tunnel junction via stress induced crystallization
    Goh, Youngin
    Hwang, Junghyeon
    Lee, Yongsun
    Kim, Minki
    Jeon, Sanghun
    [J]. APPLIED PHYSICS LETTERS, 2020, 117 (24)
  • [6] Compositional dependence of crystallization temperatures and phase evolution in hafnia-zirconia (HfxZr1-x)O2 thin films
    Hsain, H. Alex
    Lee, Younghwan
    Parsons, Gregory N.
    Jones, Jacob L.
    [J]. APPLIED PHYSICS LETTERS, 2020, 116 (19)
  • [7] Karbasian Golnaz, 2017, 2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), DOI 10.1109/VLSI-TSA.2017.7942488
  • [8] Khan AI, 2011, 2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
  • [9] Grain size engineering for ferroelectric Hf0.5Zr0.5O2 films by an insertion of Al2O3 interlayer
    Kim, Han Joon
    Park, Min Hyuk
    Kim, Yu Jin
    Lee, Young Hwan
    Jeon, Woojin
    Gwon, Taehong
    Moon, Taehwan
    Do Kim, Keum
    Hwang, Cheol Seong
    [J]. APPLIED PHYSICS LETTERS, 2014, 105 (19)
  • [10] Grain Size Engineering of Ferroelectric Zr-doped HfO2 for the Highly Scaled Devices Applications
    Liao, Jiajia
    Zeng, Binjian
    Sun, Qi
    Chen, Qiang
    Liao, Min
    Qiu, Chenguang
    Zhang, Zhiyong
    Zhou, Yichun
    [J]. IEEE ELECTRON DEVICE LETTERS, 2019, 40 (11) : 1868 - 1871