A Compact Ultrasonic Burnishing System for High Precision Planar Burnishing: Design and Performance Evaluation

被引:18
|
作者
Du, Pengfei [1 ]
Liu, Yingxiang [1 ]
Deng, Jie [1 ]
Yu, Hongpeng [1 ]
Chen, Weishan [1 ]
机构
[1] Harbin Inst Technol, State Key Lab Robot & Syst, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
Burnishing; Surface roughness; Rough surfaces; Tools; Surface topography; Acoustics; Force; Finite-element method (FEM); flat tool; no feeding mark; piezoelectric longitudinal transducer (PLT); ultrasonic burnishing (UB); NANOCRYSTAL SURFACE MODIFICATION; ALUMINUM-ALLOY;
D O I
10.1109/TIE.2021.3108723
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
A novel ultrasonic burnishing (UB) system with a flat tool using a piezoelectric longitudinal transducer (PLT) is proposed. High-precision no-feeding mark planar burnishing can be achieved by the compact system with a size of only 280 x 224 x 558 mm without the need for machine tools. Above all, the structure of the burnishing system is presented and the operation principle is analyzed in detail. A resonant frequency design method of the PLT with a tool head is discussed. Based on this, the PLT achieves the expected resonant frequency precisely. Subsequently, the test system for the PLT is built and the resonant frequency and vibration amplitude are tested, which are in good agreement with the simulation results. Ultimately, the UB experiments are carried out and the results indicate that the surface roughness of the workpiece is reduced from Ra 1.6 mu m to Ra 0.182 mu m, which is reduced by 88.31%. Furthermore, the surface topography shows that the surface without the feeding mark is generated, which is beneficial to improve the burnishing accuracy and expand the application in ultra-precision processing.
引用
收藏
页码:8201 / 8211
页数:11
相关论文
共 50 条
  • [31] High frequency ultrasonic imaging: System design and performance optimization
    Vogt, M
    Ermert, H
    FREQUENZ, 2005, 59 (5-6) : 150 - 153
  • [32] Harvesting performance of a planar thermoelectric microgenerator with a compact design
    Estrada-Wiese, Denise
    Sojo, Jose-Manuel
    Salleras, Marc
    Santander, Joaquin
    Fernandez-Regulez, Marta
    Martin-Fernandez, Inigo
    Morata, Alex
    Fonseca, Luis
    Tarancon, Albert
    20TH INTERNATIONAL CONFERENCE ON MICRO AND NANOTECHNOLOGY FOR POWER GENERATION AND ENERGY CONVERSION APPLICATIONS (POWERMEMS 2021), 2021, : 108 - 111
  • [33] High performance, compact meander dual planar EBG microstriep lowpass filter design
    Huang, Shao Ying
    Lee, Yee Hui
    PROCEEDINGS OF THE SECOND IASTED INTERNATIONAL CONFERENCE ON ANTENNAS, RADAR, AND WAVE PROPAGATION, 2005, : 77 - 82
  • [34] Performance Evaluation of High-Temperature Ultrasonic Communication System
    Huang, Xin
    Saniie, Jafar
    Bakhtiari, Sasan
    Heifetz, Alexander
    PROCEEDINGS OF THE 2020 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2020,
  • [35] Effect of roller burnishing on the high cycle fatigue performance of the high-strength wrought magnesium alloy AZ80
    Zhang, P
    Lindemann, J
    SCRIPTA MATERIALIA, 2005, 52 (10) : 1011 - 1015
  • [36] Achieving high surface integrity of Fe-based laser cladding coating by optimized temperature field-assisted ultrasonic burnishing
    Shen, Xuehui
    Zhang, Changsheng
    Peng, Hao
    Liu, Chang
    Zhang, Yu
    JOURNAL OF MANUFACTURING PROCESSES, 2022, 83 : 270 - 280
  • [37] Design and performance evaluation of a compact thermosyphon
    Pal, A
    Joshi, YK
    Beitelmal, MH
    Patel, CD
    Wenger, TM
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (04): : 601 - 607
  • [38] Design and performance evaluation of a compact thermosyphon
    Pal, A
    Joshi, Y
    Beitelmal, MH
    Patel, CD
    Wenger, T
    THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2002, : 251 - 260
  • [39] Compact trimming design of a high-precision reference
    任国栋
    赵世芳
    蒲忠胜
    魏智强
    Journal of Semiconductors, 2014, 35 (04) : 138 - 141
  • [40] Compact trimming design of a high-precision reference
    任国栋
    赵世芳
    蒲忠胜
    魏智强
    Journal of Semiconductors, 2014, (04) : 138 - 141