Reliability tests of ultrasonic bonding methods using HAST and THB technology

Reliability is one of the most important questions in any applications both on package (component), and on board (system) level. This paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters. It gives a detailed description of the most effective and economical HAST and THB method. The paper presents some new results of using the HAST and THB technology at the following fields of the reliability and life time tests: (.) reliability analyzing of assembled SMD passive components (.) water addition speed tests Finally the paper particularly deals with the ultrasonic bonding technology, the bonding and testing machines. It introduces some measuring test results on the bonding force before and after a HAST and THB test.