Reduction of Process-induced damage in atomic layer etching

被引:0
|
作者
Hirata, Akiko [1 ]
机构
[1] Sony Semicond Solut Corp, 4-14-1 Asahi Cho, Atsugi, Kanagawa 2430014, Japan
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:25 / 26
页数:2
相关论文
共 50 条
  • [41] Process-induced particle formation in the sputtering and reactive ion etching of silicon and silicon dioxide
    Steinbruechel, Christoph
    Yoo, Won Jong
    PLASMA SOURCES SCIENCE & TECHNOLOGY, 1994, 3 (03): : 273 - 277
  • [42] Plasma etching process induced poly film damage
    Chu, PT
    Chen, FC
    Hung, CC
    Chao, YC
    1997 2ND INTERNATIONAL SYMPOSIUM ON PLASMA PROCESS-INDUCED DAMAGE, 1997, : 77 - 80
  • [43] Atomic layer etching of germanium
    Ikeda, K
    Imai, S
    Matsumura, M
    APPLIED SURFACE SCIENCE, 1997, 112 : 87 - 91
  • [44] Surface damage formation during atomic layer etching of silicon with chlorine adsorption
    Tinacba, Erin Joy Capdos
    Isobe, Michiro
    Hamaguchi, Satoshi
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2021, 39 (04):
  • [45] PROCESS-INDUCED DEFECTS IN VLSI
    KOLBESEN, BO
    BERGHOLZ, W
    CERVA, H
    FIEGL, B
    GELSDORF, F
    ZOTH, G
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1991, 55 (1-4): : 124 - 131
  • [46] A novel transient current technique to characterize process-induced thin oxide damage
    Balasinki, A
    Singhal, PM
    Morgan, J
    Hodges, R
    Spinner, C
    55TH ANNUAL DEVICE RESEARCH CONFERENCE, DIGEST - 1997, 1997, : 26 - 27
  • [47] Extraction of process-induced damage in low-k/Cu damascene structure
    Chikaki, S
    Shimoyama, M
    Yagi, R
    Yoshino, T
    Shishida, Y
    Ono, T
    Ishikawa, A
    Fujii, N
    Nakayama, T
    Kohmura, K
    Tanaka, H
    Kawahara, J
    Matsuo, H
    Takada, S
    Yamanishi, T
    Hishiya, S
    Kinoshita, NHK
    Kikkawa, T
    ISSM 2005: IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, CONFERENCE PROCEEDINGS, 2005, : 422 - 425
  • [48] Fabrication of silicon-based PZT films and process-induced damage problems
    Wei, Chaogang
    Ren, Tianling
    Shao, Tianqi
    Wang, Xiaoning
    Li, Chunxiao
    Liu, Litian
    Zhu, Jun
    Qinghua Daxue Xuebao/Journal of Tsinghua University, 2003, 43 (04): : 557 - 560
  • [49] Process-induced cell damage: pneumatic versus screw-driven bioprinting
    Ning, Liqun
    Yang, Bowen
    Mohabatpour, Fatemeh
    Betancourt, Nicholas
    Sarker, M. D.
    Papagerakis, Petros
    Chen, Xiongbiao
    BIOFABRICATION, 2020, 12 (02)
  • [50] Plasma process-induced damage to Josephson tunnel junctions in superconducting integrated circuits
    Tolpygo, Sergey K.
    Amparo, Denis
    Kirichenko, Alex
    Yohannes, Daniel
    SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2007, 20 (11): : S341 - S349