SIM-DSP: A DSP-Enhanced CAD Platform for Signal Integrity Macromodeling and Simulation
被引:0
作者:
Lei, Chi-Un
论文数: 0引用数: 0
h-index: 0
机构:
Univ Hong Kong, Dept Elect & Elect Engn, Hong Kong, Hong Kong, Peoples R ChinaUniv Hong Kong, Dept Elect & Elect Engn, Hong Kong, Hong Kong, Peoples R China
Lei, Chi-Un
[1
]
机构:
[1] Univ Hong Kong, Dept Elect & Elect Engn, Hong Kong, Hong Kong, Peoples R China
Simulation;
signal integrity;
high-speed circuits;
macromodeling;
APPROXIMATION;
D O I:
暂无
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Macromodeling-Simulation process for signal integrity verifications has become necessary for the high speed circuit system design. This paper aims to introduce a "VLSI Signal Integrity Macromodeling and Simulation via Digital Signal Processing Techniques" framework (known as SIM-DSP framework), which applies digital signal processing techniques to facilitate the SI verification process in the pre-layout design phase. Core identification modules and peripheral (pre-/post-)processing modules have been developed and assembled to form a verification flow. In particular, a single-step discrete cosine transform truncation (DCTT) module has been developed for modeling-simulation process. In DCTT; the response modeling problem is classified as a signal compression problem, wherein the system response can be represented by a truncated set of non-pole-based DCT bases, and error can be analyzed through Parseval's theorem. Practical examples are given to show the applicability of our proposed framework