Role of complexing ligands in trivalent chromium electrodeposition

被引:61
作者
Zeng, Zhixiang [2 ]
Zhang, Yingxin [2 ]
Zhao, Wenjie [2 ]
Zhang, Junyan [1 ]
机构
[1] Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China
[2] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China
关键词
Trivalent chromium; Complexing ligand; Electroreduction; Geometric structure; FORMIC-ACID; BEHAVIOR; COATINGS; BATHS;
D O I
10.1016/j.surfcoat.2011.04.019
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this study, the Cr(III)-formate, COO-oxalate and Cr(III)-glycine electrolytes are used as sources for electrodepositing the Cr coatings. The deposition rate and brightness range of the electroplating process in these electrolytes are investigated. The geometric structures of the Cr complex ions are optimized, using density functional theory with General Gradient Approximation/Perdew-Wang 91 (GGA/PW91) calculation. It is found that the deposition rate and brightness range significantly depend on the geometric structure of the Cr(III)-ligand complex ions. The expansion of the distance between Cr and H(2)O induced by the introduced complexing ligand is a necessary condition for the electrochemical reduction of Cr(III) to metal Cr. The dehydration rate of Cr(III)-ligand complex ions determines the electroplating characteristics of electrolytes. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:4771 / 4775
页数:5
相关论文
共 16 条
  • [1] Modeling, optimization, and comparative analysis of trivalent chromium electrodeposition from aqueous glycine and formic acid baths
    Baral, A
    Engelken, R
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (07) : C504 - C512
  • [2] ELECTROREDUCTION OF CHROMIUM (III) - ACETATE COMPLEX TO METALLIC CHROMIUM ON THE COPPER ELECTRODE
    DRELA, I
    SZYNKARCZUK, J
    KUBICKI, J
    [J]. ELECTROCHIMICA ACTA, 1988, 33 (04) : 589 - 592
  • [3] EDIGARYAN A, 2006, Patent No. 2006118427
  • [4] Properties and preparation of amorphous chromium carbide electroplates
    Edigaryan, AA
    Safonov, VA
    Lubnin, EN
    Vykhodtseva, LN
    Chusova, GE
    Polukarov, YM
    [J]. ELECTROCHIMICA ACTA, 2002, 47 (17) : 2775 - 2786
  • [5] EISHARIF M, 1999, T I MET FINISH, V77, P139
  • [6] Electrodeposition of nanocrystalline metals and alloys from ionic liquids
    Endres, F
    Bukowski, M
    Hempelmann, R
    Natter, H
    [J]. ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2003, 42 (29) : 3428 - 3430
  • [7] Fang J., 1983, ELECTROPLATING MULTI, P83
  • [8] KHUONG P, 2007, CHEM MATER, V19, P634
  • [9] Electrochemical study on Ni-P electrodeposition
    Ordine, AP
    Díaz, SL
    Margarit, ICP
    Barcia, OE
    Mattos, OR
    [J]. ELECTROCHIMICA ACTA, 2006, 51 (8-9) : 1480 - 1486
  • [10] Characterisation of electrochemically deposited Ni-Mo alloy coatings
    Sanches, LS
    Domingues, SH
    Marino, CEB
    Mascaro, LH
    [J]. ELECTROCHEMISTRY COMMUNICATIONS, 2004, 6 (06) : 543 - 548