APPLICATION OF A TANGENTIAL MAGNETIC FIELD AND NEGATIVE REPETITIVELY PULSED BIAS FOR SUPPRESSION OF VACUUM-ARC COPPER MACROPARTICLES

被引：0

作者：

Ryabchikov, A. I. ^{[1
]}

Anan'in, P. S. ^{[1
]}

Shevelev, A. E. ^{[1
]}

机构：

[1] Natl Reseach Tomsk Polytech Univ, Tomsk, Russia

来源：

RUSSIAN PHYSICS JOURNAL | 2016年 / 59卷 / 06期

关键词：

vacuum-arc discharge; metal plasma; microdrop fraction; high-frequency short-pulse negative bias potential; CATHODIC ARC; PLASMA;

D O I：

10.1007/s11182-016-0851-3

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

The joint effect of magnetic fields normal and tangential to the cathode surface and of short-pulse high-frequency bias potential of negative polarity on the accumulation of macroparticles on the potential target immersed in copper vacuum-arc plasma is studied. It is shown that the application of a vacuum-arc evaporator with the magnetic field tangential to the cathode surface reduces by 5 times generation of copper macroparticles in comparison with an axially symmetric vacuum-arc evaporator in which the magnetic field normal to the working cathode surface is used. It is established that the joint action of the tangential field and short-pulse high-frequency bias potential makes it possible to decrease by 2-3 orders of magnitude the density of copper macroparticles on the target surface.

引用

页码：900 / 906

页数：7

共 12 条

[1]

Aksenov I. I., 1978, PRIB TEKH EKSP, V21, P236

[2] Approaches to rid cathodic arc plasmas of macro- and nanoparticles: a review [J].