A Parylene Temporary Packaging Technique for MEMS Wafer Handling

被引：1

作者：

Wen, L. ^{[1
]}

Wouters, K. ^{[1
]}

Ceyssens, F. ^{[1
]}

Witvrouw, A.

Puers, R. ^{[1
]}

机构：

[1] Katholieke Univ Leuven, ESAT MICAS, B-3001 Louvain, Belgium

来源：

EUROSENSORS XXV | 2011年 / 25卷

关键词：

Parylene; temporary packaging; MEMS; wafer handling;

D O I：

10.1016/j.proeng.2011.12.371

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

This paper presents a wafer-level temporary packaging technique utilizing a chemical vapor deposited (CVD) poly-(p-xylylene) polymer Parylene film, and oxygen plasma etching. As a test case, released, unpackaged accelerometers made in a SiGe MEMS above IC technology were coated with two different types of Parylene, Parylene N and Parylene C respectively, as a dicing protection. Oxygen plasma is used to etch the Parylene and to release the freestanding structures after dicing. The final releasing results are compared, and Parylene N turns out to be the best material for temporary packaging. The devices are electrostatically characterized after the Parylene coating. The results demonstrate the feasibility of using Parylene as a temporary protective material for both metal and semiconductor MEM devices, to prevent any damage during subsequent wafer handling and dicing. (C) 2011 Published by Elsevier Ltd.

引用

页数：4

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