Effect Of Copper Roughness On Dielectric Adhesion

被引：0

作者：

Boon, Serine Soh Siew ^{[1
]}

Sw, David Ho ^{[1
]}

Liang, Ding ^{[1
]}

Ann, Sek Soon ^{[1
]}

机构：

[1] ASTAR, Inst Microelect, 11 Sci Pk Rd,Singapore Sci Pk 2, Singapore 117685, Singapore

来源：

2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of processing the photo-sensitive insulating material on different copper surface roughness could illustrate the effect on the adhesion of these materials with a variation in surface roughness. A correlation study was conducted with copper roughness with application of both high-temperature & low-temperature curing dielectric to gain a better understanding of the resultant adhesion strength to the change in surface roughness. The morphology of the copper surface and adhesion of the polymer demonstrated the effect of chemical bonding and mechanical interlocking.

引用

页码：793 / 796

页数：4