Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices

被引：10
作者：
Yu, Fuwen [1 ]
Wang, Kang [2 ]
Liu, Jiahao [1 ]
Fu, Xing [3 ]
Chen, Hongtao [1 ]
Li, Mingyu [1 ]
机构：
[1] Harbin Inst Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China
[2] China Elect Technol Grp Corp, Res Inst 54, Shijiazhuang 050081, Hebei, Peoples R China
[3] China Sci & Technol Reliabil Phys & Applicat Elec, Dept Reliabil Design Res, Guangzhou 510610, Peoples R China
来源：
NANOTECHNOLOGY | 2020年 / 31卷 / 34期
关键词：
die attach; nanoparticle; sintering; electrochemical migration; intermetallics; power device packaging; NANO-SILVER JOINTS; ELECTROCHEMICAL MIGRATION; MECHANICAL-PROPERTIES; BONDING STRENGTH; SOLDER ALLOYS; ELECTRONICS;
D O I：
10.1088/1361-6528/ab92cd
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In this paper, high strength Cu-Cu interconnections were achieved by sintering the paste of Ag-Sn bimetallic nanoparticles at low temperature. Compared with nano-Ag paste, the outer Sn coatings of the nano-Ag particles were found to be favorable for the densification of the bondline. The microstructures of Ag-Sn bimetallic nanoparticles and the bondlines under different sintereing conditions were studied in detail by x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The Ag-Sn bimetallic nanoparticles bondline exhibit a high shear strength of 35.3 MPa and a low resistivity of 9.5 mu omega cm, when sintered at 260 degrees C for 20 min under a pressure of 0.5 MPa. The electrochemical migration time of this sintered Ag-Sn bimetallic nanoparticles was prolonged to be ten times of that of sintered nano-Ag. This bonding technology based on Ag-Sn bimetallic nanoparticles was a promising die attach method for high temperature power device packaging.
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页数：13
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