Effect of addition of CuZnAl particle on the properties of Sn solder joint

被引：23
作者：
Sun, Lei [1 ]
Chen, Ming-he [1 ]
Zhang, Liang [2 ]
Xie, Lan-sheng [1 ]
机构：
[1] Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing 210016, Peoples R China
[2] Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2020年 / 278卷
基金：
中国国家自然科学基金;
关键词：
CuZnAl particles; Interfacial reaction; TLP bonding; Microvoids; CU-SN; MICROSTRUCTURE; NI; NANOPARTICLES; RELIABILITY; ORIENTATION; IMC;
D O I：
10.1016/j.jmatprotec.2019.116507
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The effects of minor addition micron of CuZnAl particles on the melting temperature, wettability, mechanical strength and interfacial reaction in Sn/Cu solder joints were investigated. The microstructure evolution of the solder joints was observed using SEM. When the CuZnAl particles were added, the melting temperature of the solder joints was slightly reduced. The wettability and shear strength were significantly enhanced. When the content of CuZnAl particles was 0.5 wt.%, the properties of the Sn solder joints were optimized. Cu/Sn-0.5CuZnAl/Cu transient liquid phase bonding was carried out by using a composite solder having a content of 0.5 wt.%. The addition of CuZnAl particles inhibited the growth of interfacial intermetallic compounds and microvoids in Cu/Sn/Cu solder joints. The grain orientation of Cu 6 Sn 5 also became more random.
引用
收藏
页数：14
相关论文
共 21 条
  • [1] Calorimetric investigations of SrMoO3 and BaMoO3 compounds
    Agarwal, R
    Singh, Z
    Venugopal, V
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 1999, 282 (1-2) : 231 - 235
  • [2] Growth orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn microbumps and Zn-doped solder joints
    Chen, Wei-Yu
    Tu, Wei
    Chang, Hsiang-Ching
    Chou, Tzu-Ting
    Duh, Jenq-Gong
    [J]. MATERIALS LETTERS, 2014, 134 : 184 - 186
  • [3] Grain morphology of intermetallic compounds at solder joints
    Choi, WK
    Jang, SY
    Kim, JH
    Paik, KW
    Lee, HM
    [J]. JOURNAL OF MATERIALS RESEARCH, 2002, 17 (03) : 597 - 599
  • [4] Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds
    Flandorfer, H.
    Saeed, U.
    Luef, C.
    Sabbar, A.
    Ipser, H.
    [J]. THERMOCHIMICA ACTA, 2007, 459 (1-2) : 34 - 39
  • [5] The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads
    Gain, Asit Kumar
    Fouzder, Tama
    Chan, Y. C.
    Sharif, A.
    Wong, N. B.
    Yung, Winco K. C.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 506 (01) : 216 - 223
  • [6] Experimental investigation of electromigration failure in Cu-Sn-Cu micropads in 3D integrated circuits
    Huang, Zhihong
    Jones, Robert E.
    Jain, Ankur
    [J]. MICROELECTRONIC ENGINEERING, 2014, 122 : 46 - 51
  • [7] Jackson K.A., 1967, PROG SOLID STATE CH, V4, DOI DOI 10.1016/0079-6786(67)90005-2
  • [8] Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn-0.3Ag-0.7Cu-xCeO2 solder alloys
    Li, Z. H.
    Tang, Y.
    Guo, Q. W.
    Li, G. Y.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 789 : 150 - 162
  • [9] Understanding the influence of copper nanoparticles on thermal characteristics and microstructural development of a tin-silver solder
    Lin, D. C.
    Srivatsan, T. S.
    Wang, G-X.
    Kovacevic, R.
    [J]. JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2007, 16 (05) : 647 - 654
  • [10] Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy
    Liu, Ping
    Yao, Pei
    Liu, Jim
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (06) : 874 - 879
123