Cooling of electronic devices: Nanofluids contribution

被引：169

作者：

Colangelo, G. ^{[1
]}

Favale, E. ^{[1
]}

Milanese, M. ^{[1
]}

de Risi, A. ^{[1
]}

Laforgia, D. ^{[1
]}

机构：

[1] Univ Salento, Dept Engn Innovat, Via Arnesano, Lecce, Italy

来源：

APPLIED THERMAL ENGINEERING | 2017年 / 127卷

关键词：

Nanofluid; Heat transfer; Cooling; Electronics; MICROCHANNEL HEAT SINK; EFFECTIVE THERMAL-CONDUCTIVITY; CU-WATER NANOFLUID; TRANSFER ENHANCEMENT; AL2O3/WATER NANOFLUID; CONVECTIVE PERFORMANCE; FORCED-CONVECTION; AL2O3; NANOFLUIDS; VOLUME FRACTION; TURBULENT-FLOW;

D O I：

10.1016/j.applthermaleng.2017.08.042

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Cooling of electronic devices is one of the main challenge of new generation technology. The extreme miniaturization has high benefits, but the heat to be dissipated per unit of surface increases in uncontrolled way. In this paper the application of a new generation of heat transfer fluids, nanofluids, to electronic devices is analyzed. Even if the use of nanofluids is not still common, there are many papers that deal with this topic, reporting both experimental and theoretical results. The development of this technology could be one of the key elements that could give an important impulse to further miniaturization of electronic devices and at the same time increase their energy efficiency. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：421 / 435

页数：15

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