Improved RF integrated magnetic thin-film inductors by means of micro slits and surface planarization techniques

被引：37
|
作者：
Yamaguchi, M [1 ]
Baba, M
Suezawa, K
Moizumi, T
Arai, KI
Haga, A
Shimada, Y
Tanabe, S
Itoh, K
机构：
[1] Tohoku Univ, Inst Elect & Commun Engn, Sendai, Miyagi 9808577, Japan
[2] Mitsubishi Elect Corp, MCBD, Amagasaki, Hyogo 661001, Japan
[3] Mitsubishi Elect Co, ATC, Amagasaki, Hyogo 6610001, Japan
[4] Tohoku Univ, Inst Sci Measurements, Sendai, Miyagi 9808577, Japan
[5] Tohoku Gakuin Univ, Dept Elect Engn, Tagajo, Miyagi 9858537, Japan
来源：
IEEE TRANSACTIONS ON MAGNETICS | 2000年 / 36卷 / 05期
关键词：
complex permeability; inductance; microfabrication; planarization; quality factor; RF integrated inductor;
D O I：
10.1109/20.908872
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Improvement of magnetic thin-him inductors for RF monolithic microwave integrated circuits (MMIC's) is discussed. Surface planarization reduced the surface roughness down to R-a = 1.2 mm, which enhanced the quality factor by 14% over a nonplanarized inductee The orthogonal bar slit pattern was the best among the fabricated slit patterns, L = 7.55 nH (+12% of the air core), R = 6.80 Omega and Q = 7.09 (+9%) were obtained for the orthogonal bar slit pattern (slit width = 0.75 mum) with surface planarization.
引用
收藏
页码：3495 / 3498
页数：4
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