Curbing plasma-induced gate oxide damage

被引:0
作者
Gabriel, CT
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TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
摘要
Gate oxide damage occurring during plasma-based processes can degrade product yield by several percentage points. Adding an insulator to the back of the wafer can reduce charging. Optimizing plasma-etching and deposition processes is also essential for minimizing damage. An in-line damage measurement technique can rapidly catch and solve significant charging problems in a fab.
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页码:49 / +
页数:4
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