Double-pulse machining as a technique for the enhancement of material removal rates in laser machining of metals

被引：128

作者：

Forsman, AC ^{[1
]}

Banks, PS ^{[1
]}

Perry, MD ^{[1
]}

Campbell, EM ^{[1
]}

Dodell, AL ^{[1
]}

Armas, MS ^{[1
]}

机构：

[1] Gen Atom Co, Photon Div, San Diego, CA 92121 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2005年 / 98卷 / 03期

关键词：

D O I：

10.1063/1.1996834

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Several nanosecond 0.53-mu m laser pulses separated by several tens of nanoseconds have been shown to significantly enhance (three to ten times) material removal rates while minimizing redeposition and heat-affected zones. Economic, high-quality, high-aspect ratio holes ( > 10:1) in metals are produced as a result. A phenomenological model whereby the second laser pulse interacts with the ejecta produced by the first laser pulse and in close proximity to the material surface is consistent with the observations. Incident laser wavelengths of 1.05 and 0.35 mu m also benefit from this pulse format. (c) 2005 American Institute of Physics.

引用

页数：6

共 17 条

[1]

Anisimov S. I., 1984, Soviet Physics - Uspekhi, V27, P181, DOI 10.1070/PU1984v027n03ABEH004036

[2] THE USE OF POWERFUL LASERS FOR THE STUDY OF MATTER UNDER SUPERHIGH PRESSURES [J].