Thermo-mechanical deformation of underfilled flip-chip packaging

被引：16

作者：

Dai, X

Ho, PS

机构：

来源：

TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM | 1997年

关键词：

D O I：

10.1109/IEMT.1997.626939

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An experimental technique of in-situ moire interferometry has been applied to investigate the thermo-mechanical deformations induced by thermal loading in an underfilled flip-chip-on-board packaging. Thermo-mechanical deformations sand shear strains generated from CTE mismatch are determined experimentally as a function of thermal loading. Semi-quantitative agreement is established between measured and FEA-stimulated deformations. The results show that moire interferometry with in-situ thermal loading capabilities is effective for experimental studies of electronic packaging. Through this study, the role of underfill in reducing shear strains over solder bumps and thus in improving solder shear fatigue reliability is clarified. A methodology is demonstrated to differentiate effects of underfill properties on packaging thermo-mechanical performance.

引用

页码：326 / 333

页数：8