Development of a millimeter-wave system-on-a-package utilizing MCM integration

被引：0
|
作者：
Pham, A [1 ]
Ramachandran, R
Laskar, J
Krishnamurthy, V
Bates, D
Marcinkewicz, W
Schmanski, B
Piacente, P
Sprinceanu, L
机构：
[1] Clemson Univ, Dept Elect & Comp Engn, Clemson, SC 29634 USA
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
[3] Natl Semicond Corp, Norcross, GA 30071 USA
[4] Dielect Lab, Cazenovia, NY 13035 USA
[5] Ericsson Inc, Res Triangle Pk, NC 27709 USA
[6] Lockheed Sanders, Nashua, NH 03060 USA
[7] GE Co, Ctr Corp Res & Dev, Schenectady, NY 12301 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2001年 / 49卷 / 10期
关键词：
heterogeneous; integration; millimeter wave; organic; SOP;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners.
引用
收藏
页码：1747 / 1749
页数：3
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