Development of a millimeter-wave system-on-a-package utilizing MCM integration

We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners.