1060-nm VCSEL-based parallel-optical modules for optical interconnects

被引：0

作者：

Nishimura, N. ^{[1
]}

Nagashima, K. ^{[1
]}

Kise, T. ^{[1
]}

Rizky, A. F. ^{[1
]}

Uemura, T. ^{[1
]}

Nekado, Y. ^{[1
]}

Ishikawa, Y. ^{[1
]}

Nasu, H. ^{[1
]}

机构：

[1] Furukawa Elect Corp Ltd, Fitel Prod Div, Ichihara, Chiba 2908555, Japan

来源：

OPTICAL INTERCONNECTS XV | 2015年 / 9368卷

关键词：

Optical interconnects; VCSEL; parallel-optical module; Solder reflow; polymer waveguide;

D O I：

10.1117/12.2078757

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The capability of mounting a parallel-optical module onto a PCB through solder-reflow process contributes to reduce the number of piece parts, simplify its assembly process, and minimize a foot print for both AOC and on-board applications. We introduce solder-reflow-capable parallel-optical modules employing 1060-nm InGaAs/GaAs VCSEL which leads to the advantages of realizing wider modulation bandwidth, longer transmission distance, and higher reliability. We demonstrate 4-channel parallel optical link performance operated at a bit stream of 28 Gb/s 2(31)-1 PRBS for each channel and transmitted through a 50-mu m-core MMF beyond 500 m. We also introduce a new mounting technology of parallel-optical module to realize maintaining good coupling and robust electrical connection during solder-reflow process between an optical module and a polymer-waveguide-embedded PCB.

引用

页数：8

共 8 条

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Alajoki, Teemu
Tanskanen, Antti
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Kautio, Kari
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Immonen, Marika
Kivilahti, Jorma
[J]. 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 799 - +
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