Advanced CMOS-MEMS Resonator Platform

被引:37
作者
Li, Cheng-Syun [1 ]
Hou, Li-Jen [1 ]
Li, Sheng-Shian [1 ]
机构
[1] Natl Tsing Hua Univ, Inst Nanoengn & Microsyst, Hsinchu 30013, Taiwan
关键词
CMOS-MEMS; composite structure; deep submicrometer gap; monolithic integration; resonators; thermal stability;
D O I
10.1109/LED.2011.2175695
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Deep-submicrometer-gap CMOS-MEMS "composite" resonators fabricated using 0.18-mu m-1-poly-6-metal foundry CMOS technology have been demonstrated for the first time to substantially improve their electromechanical coupling coefficient, hence leading to a motional impedance of only 880 k Omega at 15.3 MHz. A simple maskless wet release process has been successfully transferred from a 0.35-mu m platform to an advanced 0.18-mu m version, capable of offering enhanced gap spacing and transduction area for CMOS-MEMS resonators monolithically integrated with high-performance CMOS circuitry. This proposed platform offers ease of use, fast turnaround time, low cost, convenient prototyping, and inherent MEMS-circuit integration, therefore showing great potential toward future integrated sensing and single-chip RF applications.
引用
收藏
页码:272 / 274
页数:3
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