Ultra-small compact transfer molded package for power modules

被引：0

作者：

Sano, Ko ^{[1
]}

Hayashi, Kenichi ^{[1
]}

Kawafuji, Hisashi ^{[2
]}

Funakoshi, Nobuhito ^{[3
]}

机构：

[1] Mitsubishi Electr Corp, Mfg Engn Ctr, 8-1-1 Tsukaguchi Honmachi, Amagasaki, Hyogo, Japan

[2] Mitsubishi Electr Corp, Power Device Works, Fukuoka, Japan

[3] Fukuryo Semicond Engn Corp, Fukuoka, Japan

来源：

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS | 2008年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

DIP-IPMs are intelligent power modules that integrate power devices, drivers and protection circuits in a dual-in-line transfer-molded package. The new generation DIP-IPM package applies an "isolated thermal sheet" and a unique molding process. The thermal sheet is composed of a ceramic filler with high thermal conductivity and a thermosetting resin. This sheet is attached to the lead frame so as to not form any clearance, and the other side is exposed on the surface of the package. This technique contributes to the reduction of the thermal resistance to one third that of a conventional one, and a space savings of approximately 40% for the package.

引用

页码：1832 / +

页数：2