Thermoanalytical characterization of thermoset polymers for chemical mechanical polishing

被引：8

作者：

Tregub, A ^{[1
]}

Ng, G ^{[1
]}

Sorooshian, J ^{[1
]}

Moinpour, M ^{[1
]}

机构：

[1] Intel Corp, Santa Clara, CA 95054 USA

来源：

THERMOCHIMICA ACTA | 2005年 / 439卷 / 1-2期

关键词：

chemical mechanical planarization; thermal analysis; pad;

D O I：

10.1016/j.tca.2005.07.016

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Thermal analytical study of two types of polyurethane-based polishing pads for chemical mechanical planarization (CMP) was conducted using DMA, TMDSC, TMA, and TGA. The pads were subjected to thermal treatments at various temperatures for different time. Based on the results of thermal analysis, recommendations to optimize pad properties were made. (C) 2005 Elsevier B.V All rights reserved.

引用

页码：44 / 51

页数：8

共 11 条

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