Chip-to-chip communications using capacitive interconnects

被引：0
|
作者：
Viitala, Olli [1 ]
Ryynanen, Jussi [1 ]
机构：
[1] Aalto Univ, Dept Micro & Nanosci, FIN-00076 Aalto, Finland
来源：
2010 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS | 2010年
关键词：
LINK;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a transceiver for capacitive interconnects between two chips. The capacitive link model was simulated with an EM-simulator and a lumped circuit model was developed from the simulations. The channel model was then used in the design of the transceiver. The designed transceiver was implemented in 65-nm CMOS and the chip stack was assembled with standard equipment. The paper also presents the BER measurement results for the transceiver.
引用
收藏
页码：2888 / 2891
页数：4
相关论文
共 50 条
  • [1] Optical Interconnects for Chip-to-Chip Communications
    Fields, Mitchell
    2010 36TH EUROPEAN CONFERENCE AND EXHIBITION ON OPTICAL COMMUNICATION (ECOC), VOLS 1 AND 2, 2010,
  • [2] Ultrawideband design challenges for wireless chip-to-chip communications and interconnects
    Celebi, Hasari
    Ahin, Mustafa E.
    Arslan, Huseyin
    Haque, Jamal
    Prado, Edward R.
    Markell, David P.
    2006 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2006, : 2408 - +
  • [3] Chip-to-Chip Interconnects Using Integrated Antennas
    Yordanov, Hristomir
    Russer, Peter
    2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2008, : 1464 - 1467
  • [4] Boosting Off-chip Interconnects through Chip-to-Chip Capacitive Coupled Communication
    Zhang, Xiang
    Park, Dongwon
    Cheng, Chung-Kuan
    2017 IEEE 26TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2017,
  • [5] Chip-to-chip optical interconnects
    Kash, J. A.
    Doany, F. E.
    Schares, L.
    Schow, C. L.
    Schuster, C.
    Kuchta, D. M.
    Pepejugoski, P. K.
    Trewhella, J. M.
    Baks, C. W.
    John, R. A.
    Shan, L.
    Kwark, Y. H.
    Budd, R. A.
    Chiniwalla, P.
    Libsch, F. R.
    Rosner, J.
    Tsang, C. K.
    Patel, C. S.
    Schaub, J. D.
    Kucharski, D.
    Guckenherger, D.
    Hegde, S.
    Nyikal, H.
    Dangel, R.
    Horst, F.
    Offrein, B. J.
    Lin, C. K.
    Tandon, A.
    Trott, G. R.
    Nystrom, M.
    Bour, D.
    Tan, M. R. T.
    Dolfi, D. W.
    2006 OPTICAL FIBER COMMUNICATION CONFERENCE/NATIONAL FIBER OPTIC ENGINEERS CONFERENCE, VOLS 1-6, 2006, : 2316 - +
  • [6] Integrated free-space optical interconnects for chip-to-chip communications
    Jahns, J
    FIFTH INTERNATIONAL CONFERENCE ON MASSIVELY PARALLEL PROCESSING, PROCEEDINGS, 1998, : 20 - 23
  • [7] Optical chip-to-chip interconnects for memory systems
    Boudreaux, O
    Cho, SY
    Shin, J
    Chellappa, A
    Schimmel, D
    Brooke, M
    Jokerst, NM
    2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2003, : 301 - 302
  • [8] Flex-circuit chip-to-chip interconnects
    Braunisch, Henning
    Jaussi, James E.
    Mix, Jason A.
    Trobough, Mark B.
    Horine, Bryce D.
    Prokofiev, Victor
    Lu, Daoqiang
    Baskaran, Rajashree
    Meier, Pascal C. H.
    Han, Dong-Ho
    Mallory, Kent E.
    Leddige, Michael W.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1853 - +
  • [9] Silicon circuits for chip-to-chip communications in multi-socket server board interconnects
    Moralis-Pegios, Miltiadis
    Pitris, Stelios
    Mitsolidou, Charoula
    Fotiadis, Konstantinos
    Ramon, Hannes
    Lambrecht, Joris
    Bauwelinck, Johan
    Yin, Xin
    Ban, Yoojin
    De Heyn, Peter
    Van Campenhout, Joris
    Lamprecht, Tobias
    Lehnman, Andreas
    Pleros, Nikos
    Alexoudi, Theoni
    IET OPTOELECTRONICS, 2021, 15 (02) : 102 - 110
  • [10] Emerging technology for backplanes and chip-to-chip interconnects
    Morozov, VN
    Guilfoyle, PS
    Louderback, DA
    2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2003, : 234 - 235
12345