Simulation-based optimization in virtual thermo-mechanical prototyping of electronic packages

被引:0
作者
Zhang, GQ [1 ]
Stehouwer, HP [1 ]
机构
[1] Ctr Ind Technol Philips, NL-5600 MD Eindhoven, Netherlands
来源
BENEFITING FROM THERMAL AND MECHANICAL SIMULATION IN MICRO-ELECTRONICS | 2000年
关键词
virtual prototyping; electronic packaging; thermo-mechanical reliability; simulation-based optimization;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents some of our recent research and development results for virtual thermo-mechanical prototyping of electronic packages. Philips simulation-based optimization strategy focusing on the development of reliable Response Surface Models for the underlying nonlinear responses is demonstrated. This strategy, plays a vital role in the realization of virtual thermo-mechanical prototyping of electronic packages. The demonstrator presented in this paper shows that combining reliable nonlinear FEM-based simulation models with this optimization strategy is an effective and efficient method for virtual thermo-mechanical prototyping of electronic packages.
引用
收藏
页码:151 / 164
页数:14
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