Residual stress measurement using the hole drilling method and laser speckle interferometry: Part I

被引:107
作者
Steinzig, M [1 ]
Ponslet, E [1 ]
机构
[1] HYTEC Inc, Los Angeles, CA USA
关键词
D O I
10.1111/j.1747-1567.2003.tb00114.x
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Residual stress measurements are discussed. Hole drilling method and laser speckle interferometry are used. It was found that electronic speckle pattern interferometer (ESPI) hole drilling is much faster than the strin gage hole drilling technique.
引用
收藏
页码:43 / 46
页数:4
相关论文
共 9 条
[1]  
[Anonymous], 1992, STANDARD TEST METHOD
[2]  
ANTONOV AA, 1983, WELD PROD+, V30, P29
[3]   Determination of residual stresses using hole drilling and digital speckle pattern interferometry with automated data analysis [J].
Díaz, F ;
Kaufmann, GH ;
Galizzi, GE .
OPTICS AND LASERS IN ENGINEERING, 2000, 33 (01) :39-48
[4]   RESIDUAL-STRESS DETERMINATION BY SINGLE-AXIS HOLOGRAPHIC-INTERFEROMETRY AND HOLE DRILLING .1. THEORY [J].
MAKINO, A ;
NELSON, D .
EXPERIMENTAL MECHANICS, 1994, 34 (01) :66-78
[5]  
Mathar J, 1934, T AM SOC MECH ENG, P249
[6]  
McDonach A., 1983, Experimental Techniques, V7, P20, DOI 10.1111/j.1747-1567.1983.tb01766.x
[7]  
OSGOOD C, 1954, RESIDUAL STRESSES ME, P1
[8]  
Pritt M. D., 1998, 2 DIMENSIONAL PHASE
[9]  
STEINZIG M, 2001, P ASME PRESS VESS PI, V429, P65