Thin carbon films as electrodes for bioelectronic applications

被引:30
作者
Schnupp, R [1 ]
Kuhnhold, R
Temmel, G
Burte, E
Ryssel, H
机构
[1] Fraunhofer Inst Integrated Circuits, D-91058 Erlangen, Germany
[2] Univ Erlangen Nurnberg, Chair Electron Devices, D-8520 Erlangen, Germany
关键词
thin carbon films; diamond-like-carbon; carbon electrode; electrochemistry of carbon electrodes; bioelectronics;
D O I
10.1016/S0956-5663(98)00057-8
中图分类号
Q6 [生物物理学];
学科分类号
071011 ;
摘要
Thin film diamond-like carbon (DLC) electrodes were fabricated by radio frequency (RF) magnetron sputtering on silicon, silicon oxide, and platinum substrates. The dependence of physical and electrochemical properties on process parameters like temperature, pressure, and incident power was investigated. We deposited carbon layers with hydrogen concentrations below 1%. Therefore, the resistivity was minimized to a value of 30 m Ohm cm. The low surface roughness of all DLC films leaded to a small double-layer capacity of 37 mu F/cm(2). A large electrochemical bandwidth and a nearly ideal reversibility was shown and compared to the properties of conventional glassy carbon electrodes. The applicability of the DLC electrodes to electrochemical investigations and bioelectronic applications was demonstrated. (C) 1998 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:889 / 894
页数:6
相关论文
共 16 条
[11]   Electronic structure of diamond-like carbon [J].
Robertson, J .
DIAMOND AND RELATED MATERIALS, 1997, 6 (2-4) :212-218
[12]   Development of thin film electrodes based on sputtered amorphous carbon [J].
Schlesinger, R ;
Bruns, M ;
Ache, HJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (01) :6-15
[13]   Low temperature diamond growth using fluorinated hydrocarbons [J].
Schmidt, I ;
Hentschel, F ;
Benndorf, C .
DIAMOND AND RELATED MATERIALS, 1996, 5 (11) :1318-1322
[14]  
TAMER MA, 1994, J APPL PHYS, V76, P3823
[15]  
WU IL, 1992, SEMICONDUCTOR SCI TE, V7, P233
[16]   POLYCRYSTALLINE DIAMOND PRESSURE SENSOR [J].
WUR, DR ;
DAVIDSON, JL ;
KANG, WP ;
KINSER, DL .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1995, 4 (01) :34-41