Hygro-thermal mechanical analysis of flip chip package by finite element method

被引：0
|
作者：
Niu, Xiao-yan [1 ]
Li, Zhi-gang [1 ]
Yuan, Guo-zheng [1 ]
Shu, Xue-feng [1 ]
机构：
[1] Taiyuan Univ Technol, Inst Appl Mech, Taiyuan 030024, Peoples R China
来源：
PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON NONLINEAR MECHANICS | 2007年
关键词：
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
The purpose of this paper is to study the effect of moisture and thermal cycling loads on the reliability of flip chip ball grid array (FCBGA) packages using lead free and lead containing solders materials. Firstly, simplified thermal and mechanical finite element models are presented for the analysis of thermal stress during the thermal cycling testing. Anand model is selected to describe the material creep behaviors of 63Sn37Pb and 96.5Sn3.5Ag. Under the same loading condition, the performances of two kinds of solders are compared and give a good guideline on the lead free solders for replacement of lead containing solders materials. Secondly, for moisture diffusion modeling, thermal-moisture analogy is used to calculate the degree of moisture saturation in the multi-material system of FCBGA. Moisture diffusivity absorption at preconditioning temperature is modeled. The results offer theoretical support for interface delamination.
引用
收藏
页码：829 / 832
页数：4
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